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Boyd Hi-Contact™ Tube Liquid Cold Plates (LCP’s) for low to medium power density applications

Boyd Corporation’s Hi-Contact™ technology optimizes the contact area liquid tubes have with a cooling surface to provide the best possible liquid cold plate thermal performance. The patented geometry used in these designs ensures the most tube-to-plate and tube-to-device contact possible to minimize interface resistance between all contact surfaces. To further increase performance, a thermal epoxy…

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